MECHANIC UV50 Rosin-Based Solder Flux Paste | No-Clean BGA, SMD, PCB Soldering Gel for Mobile Phone and Electronics Chip Repair

Achieve flawless, professional-grade soldering results with the MECHANIC UV50 Rosin-Based Solder Flux Paste. This jar of high-synthetic flux cream is specifically formulated to facilitate soldering by aggressively cleaning and preventing metal oxidation on components, allowing the solder to create strong, reliable mechanical and electrical bonds. The flux also acts as an excellent wetting agent, significantly improving solder flow and efficiency.

Featuring a neutral pH and strong insulation properties, the UV50 is classified as non-corrosive, making it the best choice for delicate work on modern electronics, including PC Cards, mobile phones, and sophisticated chip-level welding. It guarantees a smooth, bright, and full solder joint, eliminating common soldering issues like cold welds or false welding. Its superior compacity makes it universally applicable for PCB repair, BGA, SMD, and PGA reballing, ensuring high bond strength every time.

Key Features:

• Type: High Synthetic Rosin-Based Solder Flux Paste/Gel (UV50).
• Volume/Weight: Generous 50{g} container size.
• Non-Corrosive: Specifically formulated to be non-corrosive to IC and PCB materials.
• Quality & Safety: Features PH value neutral and strong insulation properties.
• Wetting Agent: Acts as an effective wetting agent, creating smooth and bright solder surfaces.
• Super Compacity: Applicable to PCB, BGA, SMD, and PGA repair and soldering.
• Viscosity & Granularity: High consistency with Viscosity and Granularity.