Classic Mechanic Solder Paste Soldering Tin Cream XGSP50– High Precision Soldering Solution

Boost your soldering efficiency with the Classic Mechanic Solder Paste Soldering Tin Cream XGSP50, specially designed for precision and reliability. Ideal for electronics repair, PCB soldering, and rework applications, this high-performance solder paste ensures clean and consistent joints, even on the most delicate circuits.

Key Features:

Premium Quality: Original XGSP50 formula offers superior adhesion and low residue for professional-grade soldering.

Smooth Application: Comes in an easy-to-use syringe for precise application and minimal waste.

Excellent Conductivity: Contains fine solder alloy particles for strong electrical conductivity.

Long Shelf Life: Stable formulation allows long-term storage without degradation.

Wide Compatibility: Suitable for BGA, SMD, SMT, and reflow soldering techniques.

Specifications:

Model: XGSP850

Type: No-clean solder paste

Net Weight: 42g (approx.)

Flux Type: RMA (Rosin Mildly Activated)

Alloy Composition: Sn63/Pb37

Particle Size: 20–38μm

Melting Point: 183°C

Application: Ideal for electronics, mobile repair, and PCB assembly

Whether you're a DIY enthusiast or a professional technician, the Classic Mechanic Solder Paste Soldering Tin Cream XGSP80 offers the perfect blend of quality, ease, and precision for all your soldering needs.